MOXA

BXP-A100-E2-T-Win10

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Box-type computer with fanless design

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Intel Atom® X Series processor

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Rich interface options for up to 10 serial and 10 LAN ports

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Compact size to fit most field applications

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-30 to 60°C operating temperature range

BXP-A100-E2-8L-T

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Box-type computer with fanless design

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Intel Atom® X Series processor

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Rich interface options for up to 10 serial and 10 LAN ports

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Compact size to fit most field applications

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-30 to 60°C operating temperature range

BXP-A100-E2-2L3C-T

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Box-type computer with fanless design

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Intel Atom® X Series processor

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Rich interface options for up to 10 serial and 10 LAN ports

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Compact size to fit most field applications

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-30 to 60°C operating temperature range

BXP-A100-E2-8C-T

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Box-type computer with fanless design

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Intel Atom® X Series processor

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Rich interface options for up to 10 serial and 10 LAN ports

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Compact size to fit most field applications

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-30 to 60°C operating temperature range

BXP-A100-E4-2L3C-T

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Box-type computer with fanless design

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Intel Atom® X Series processor

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Rich interface options for up to 10 serial and 10 LAN ports

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Compact size to fit most field applications

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-30 to 60°C operating temperature range

EXPC-F2150W-TL7-DC

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15.6 inch 16:9 display

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High-performance Tiger Lake Intel® Core™ i7/ Core™ i5/Core™ i3 or Intel® Celeron® processor

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Built-in light sensor for auto brightness control

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1200-nit sunlight-readable anti-glare display

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Optical bonding of the display for deploying in harsh environments

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Fanless thermal design for efficient heat dissipation in high-temperature environments

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UL C1D2/C2D2, ATEX, and IECEx ZONE 2/Zone 22 compliant

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Front IP66 and rear IP42 certified

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-40 to 70°C operating temperature range

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Options for 5G and Wi-Fi 6 connections

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Designed for deploying in hazardous locations and for mission-critical applications

MC-3201-TGL3-M-S

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11th Gen Intel® Core™ processor (Tiger Lake U)

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2 built-in DDR4 memory slots; total capacity up to 32 GB

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Variety of interfaces: 2 serial ports, 4 Giga LAN ports, 2 USB 3.1 (type A) ports, and 4 USB 2.0 (type A) ports

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Built-in TPM 2.0 module

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Complies with DNV, IEC-60945, and IACS E10 standards

MC-3201-TGL7-S-S

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11th Gen Intel® Core™ processor (Tiger Lake U)

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2 built-in DDR4 memory slots; total capacity up to 32 GB

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Variety of interfaces: 2 serial ports, 4 Giga LAN ports, 2 USB 3.1 (type A) ports, and 4 USB 2.0 (type A) ports

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Built-in TPM 2.0 module

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Complies with DNV, IEC-60945, and IACS E10 standards

MC-3201-TGL5-M-S

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11th Gen Intel® Core™ processor (Tiger Lake U)

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2 built-in DDR4 memory slots; total capacity up to 32 GB

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Variety of interfaces: 2 serial ports, 4 Giga LAN ports, 2 USB 3.1 (type A) ports, and 4 USB 2.0 (type A) ports

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Built-in TPM 2.0 module

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Complies with DNV, IEC-60945, and IACS E10 standards

MC-3201-TGL5-S-S

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11th Gen Intel® Core™ processor (Tiger Lake U)

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2 built-in DDR4 memory slots; total capacity up to 32 GB

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Variety of interfaces: 2 serial ports, 4 Giga LAN ports, 2 USB 3.1 (type A) ports, and 4 USB 2.0 (type A) ports

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Built-in TPM 2.0 module

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Complies with DNV, IEC-60945, and IACS E10 standards

MC-3201-TGL1-M-S

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11th Gen Intel® Core™ processor (Tiger Lake U)

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2 built-in DDR4 memory slots; total capacity up to 32 GB

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Variety of interfaces: 2 serial ports, 4 Giga LAN ports, 2 USB 3.1 (type A) ports, and 4 USB 2.0 (type A) ports

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Built-in TPM 2.0 module

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Complies with DNV, IEC-60945, and IACS E10 standards

MC-3201-TGL3-S-S

__feature_benefit

11th Gen Intel® Core™ processor (Tiger Lake U)

__feature_benefit

2 built-in DDR4 memory slots; total capacity up to 32 GB

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Variety of interfaces: 2 serial ports, 4 Giga LAN ports, 2 USB 3.1 (type A) ports, and 4 USB 2.0 (type A) ports

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Built-in TPM 2.0 module

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Complies with DNV, IEC-60945, and IACS E10 standards